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Global High-end Copper Foil Market by 2024 Analysis, Growth, Drivers, Market Size, Challenges, Opportunities, Manufacturers, Types, Applications, Regions

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High-end Copper Foil

GlobalHigh-end Copper Foil Market is expected to an extensive growth during the forecast period 2018-2023. High-end Copper Foil Market report provides in detail analysis of market with revenue growth and future trends. report includes the forecasts, market size, share estimates and profiles of the leading industry Players.

The market for high-end copper foil is expected to register a CAGR of 6.35% during the forecast period (2019-2024). One of the major factors driving the market studied is the growing application as a printed circuit board (PCB) material. Development of single crystal graphene sheet as a substitute for copper foil is expected to hinder the growth of the market studied.

– Circuit boards application dominated the market in 2019, and is expected to grow at a moderate rate during the forecast period, owing to the increasing demand for consumer gadgets, such as smartphones, PCs, tablets, and other medical electronics products.
– Copper foils in transformer and grid-level energy storage are likely to act as an opportunity in the future.
– Asia-Pacific dominated the market across the world, with the largest consumption from countries, such as China and India.

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Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

High-end Copper Foil Market by Companies

  • Mitsui Mining & Smelting Co. Ltd
  • The Furukawa Electric Co. Ltd
  • Chang Chun Petrochemical Co. Ltd
  • JX Nippon Mining & Metals Corporation
  • Fukuda Metal Foil & Powder Co. Ltd
  • Targray Technology International Inc.
  • Olin Brass (Global Brass and Copper Holdings Inc.)

    Key Market Trends

    Growing Application as a Printed Circuit Board (PCB) Material

    – High-end copper foils are often used in the manufacturing of single- and double-sided printed circuit boards (PCBs). PCBs usually consist of a woven glass epoxy base material, which is clad with copper on one side or both sides of the board with varying thickness.
    – The copper foils that are used in circuit boards typically vary from 0.0007 and 0.00134 inches in thickness, and have an average weight of 1 oz. per square foot.
    – The different classes of copper used in the PCB industries have their own limitation and capabilities. Both, rolled copper and electro-deposited (ED) copper are used during the manufacturing process.
    – The development of PCBs offers the electronics industry with a reliable and cost-effective way to interconnect electronic components.
    – The demand for printed circuit boards and laminates is proportional to the demand for computers and other sophisticated electronic equipment. The computer components include mainframes, peripherals, mini-computers, terminals, printers, and various add-on devices.
    – These are also used in communication devices, military equipment, industrial electronics, scientific and medical instruments, business and educational equipment, tablets, cell phones, mobile radios, electronic warfare apparatus, and guidance control systems.
    – With an increase in world population and the increase in disposable incomes of individuals, the demand for these devices is increasing. This, in turn, is increasing the demand for PCBs.
    – With the increasing implementation of PCBs in numerous electronic equipment and devices, the demand for high-end copper foils is expected to continue to increase in the coming years.

    Asia-Pacific Region to Dominate the Market

    The Asia-Pacific region dominated the global market share in 2019, owing to the increasing production activities in countries, including China and India, among others. More than 50% of PCBs are manufactured in China, owing to the huge incentives offered by the government to PCB factories. China is also producing these circuit boards at a very low cost. As a result, many companies across the world are closing their operations. In India, the FAME scheme has been launched by the government to boost the electric vehicles manufacturing, which aims to achieve production of around 7 million EVs (Electric Vehicles) by 2020. The PCB manufacturers in South Korea have advanced technical skills, which is likely to benefit the high-end copper foil market. These manufacturers have won orders for PCB from Apple. TAESUNG is the main company dealing with the manufacturing of PCB for Apple. The aforementioned factors, coupled with government support, are like to contribute to the increasing demand for high-end copper foil consumption in the region, during the forecast period.

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    Table of Content of Global High-end Copper Foil Market – Growth, Trends, Forecast and Challenges (2019 – 2023)

    1. Introduction

    1.1 Study Deliverables

    1.2 General Study Assumptions

    2. Research Methodology

    2.1 Introduction

    2.2 Analysis Methodology

    2.3 Study Phases

    2.4 Econometric Modelling

    3. Executive Summary

    4. Market Overview and Trends of High-end Copper Foil Market

    4.1 Introduction

    4.2 Market Trends

    4.3 Porter’s Five Force Framework

    4.3.1 Bargaining Power of Suppliers

    4.3.2 Bargaining Power of Consumers

    4.3.3 Threat of New Entrants

    4.3.4 Threat of Substitute Products and Services

    4.3.5 Competitive Rivalry within the Industry

    5. Market Dynamics of High-end Copper Foil Market

    5.1 Drivers

    5.1.1 Increasing Production

    5.1.2 Rising Demand

    5.2 Restraints

    5.3 Opportunities

    6. Global High-end Copper Foil Market Segmentation, By Capacity

    7. Global High-end Copper Foil Market Segmentation, By Material Type

    7.1 Type 1

    7.2 Type 2

    7.3 Type 3

    8. Global High-end Copper Foil Market Segmentation, Segmented by Region

    8.1 North America

    8.1.1 United States

    8.1.2 Canada

    8.1.3 Rest of North America

    8.2 Asia-Pacific

    8.2.1 China

    8.2.2 Japan

    8.2.3 India

    8.2.4 Rest of Asia-Pacific

    8.3 Europe

    8.3.1 United Kingdom

    8.3.2 Germany

    8.3.3 France

    8.3.4 Russia

    8.3.5 Rest of Europe

    8.4 Rest of the World

    8.4.1 Brazil

    8.4.2 South Africa

    8.4.3 Others

    9. Competitive Landscape and Introduction of High-end Copper Foil Market

    9.1 Introduction

    9.2 Market Share Analysis

    9.3 Developments of Key Players

    10. Key Vendor Analysis (Overview, Products & Services, Strategies)

    10.1 Company 1

    10.2 Company 2

    10.3 Company 3

    10.4 Company 4

    10.5 Company 5

    11. Disclaimer

    And Many More….

    Browse Table Of Content(TOC) At – https://www.absolutereports.com/TOC/14244107#TOC

    No. of Pages: – 110

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